SPESIFIKASI PC HP COMPAQ DC5800 MICROTOWER

23.38 Dicky A. Rahman 0 Comments


1.       Motherboard :
Ø  CPU
A.      CPU Properties  
CPU Type            DualCore Intel Core 2 Duo E6750, 2666 MHz (8 x 333)
CPU Alias             Conroe
CPU Stepping    G0
Instruction Set  x86, x86-64, MMX, SSE, SSE2, SSE3, SSSE3
Original Clock     2667 MHz
Min / Max CPU Multiplier             6x / 8x
L1 Code Cache   32 KB per core
L1 Data Cache    32 KB per core
L2 Cache              4 MB  (On-Die, ECC, ASC, Full-Speed)
               
B.      Multi CPU             
CPU #1 Intel(R) Core(TM)2 Duo CPU E6750 @ 2.66GHz, 2660 MHz
CPU #2 Intel(R) Core(TM)2 Duo CPU E6750 @ 2.66GHz, 2660 MHz
               
C.      CPU Physical Info              
Package Type                    775 Contact FC-LGA6
Package Size                      37.5 mm x 37.5 mm
Transistors                          291 million
Process Technology        8M, 65 nm, CMOS, Cu, Low-K Inter-Layer, 2nd Gen Strained Si
Die Size                                                143 mm2
Core Voltage                      1.350 V
I/O Voltage                         1.350 V
Typical Power                    65 W @ 2.66 GHz
Maximum Power             99.4 W @ 2.66 GHz
               
D.      CPU Manufacturer           
Company Name               Intel Corporation
Product Information       http://ark.intel.com/search.aspx?q=Intel Core 2 Duo E6750
Driver Update                   http://www.aida64.com/driver-updates
               
E.       CPU Utilization   
CPU #1 / Core #1              3 %
CPU #1 / Core #2              3 %
F.       CPUID Properties              
CPUID Manufacturer      GenuineIntel
CPUID CPU Name            Intel(R) Core(TM)2 Duo CPU E6750 @ 2.66GHz
CPUID Revision                 000006FBh
IA Brand ID                         00h  (Unknown)
Platform ID                         2Eh / MC 01h  (LGA775)
Microcode Update Revision        B6
HTT / CMP Units               0 / 2
Tjmax Temperature        90 °C  (194 °F)
               
G.     Instruction Set   
64-bit x86 Extension (AMD64, Intel64)    Supported
IA MMX                                                               Supported
IA SSE                                                                    Supported
IA SSE2                                                                 Supported
IA SSE3                                                                 Supported
IA Supplemental SSE3                                    Supported
CLFLUSH Instruction                                       Supported
CMPXCHG8B Instruction                               Supported
CMPXCHG16B Instruction                            Supported
Conditional Move Instruction                     Supported
MONITOR / MWAIT Instruction                 Supported
SYSENTER / SYSEXIT Instruction                 Supported         
H.      Security Features              
Data Execution Prevention (DEP, NX, EDB)           Supported
I.        Power Management Features    
Automatic Clock Control               Supported
Digital Thermometer                      Supported
Enhanced Halt State (C1E)            Supported, Enabled
Enhanced SpeedStep Technology (EIST, ESS)      Supported, Enabled
Processor Duty Cycle Control      Supported
Thermal Monitor 1                          Supported
Thermal Monitor 2                          Supported         
Ø  CPUID
A.      CPUID Features             
36-bit Page Size Extension           Supported
CPL Qualified Debug Store           Supported
Debug Trace Store                           Supported
Debugging Extension                     Supported
Fast Save & Restore                        Supported
Invariant Time Stamp Counter   Supported
Local APIC On Chip                          Supported
Machine Check Architecture (MCA)        Supported
Machine Check Exception (MCE)              Supported
Memory Type Range Registers (MTRR)  Supported
Model Specific Registers (MSR) Supported
Page Attribute Table (PAT)          Supported
Page Global Extension                   Supported
Page Size Extension (PSE)            Supported
Pending Break Event                      Supported
Physical Address Extension (PAE)             Supported
Safer Mode Extensions (SMX)   Supported
Self-Snoop                                          Supported
Time Stamp Counter (TSC)           Supported
Virtual Machine Extensions (Vanderpool)             Supported
Virtual Mode Extension                                Supported
Ø  Motherboard
A.      Motherboard Properties           
  Motherboard ID             <DMI>
Motherboard Name     Hewlett-Packard HP Compaq dc5800 Microtower
             
B.      Front Side Bus Properties          
Bus Type            Intel AGTL+
Bus Width         64-bit
Real Clock          333 MHz (QDR)
Effective Clock                1333 MHz
Bandwidth        10664 MB/s
             
C.      Memory Bus Properties             
Bus Type            Dual DDR2 SDRAM
Bus Width         128-bit
DRAM:FSB Ratio             1:1
Real Clock          333 MHz (DDR)
Effective Clock                666 MHz
Bandwidth        10664 MB/s
             
D.      Chipset Bus Properties               
Bus Type            Intel Direct Media Interface
Ø  Memory
A.      Physical Memory          
Total      2031 MB
Used     763 MB
Free       1267 MB
Utilization            38 %
     
B.      Swap Space     
Total    4062 MB
Used   945 MB
Free     3117 MB
Utilization          23 %
     
C.      Virtual Memory             
Total    6093 MB
Used   1709 MB
Free     4384 MB
Utilization          28 %
     
D.      Paging File        
Paging File         C:\pagefile.sys
Current Size     2031 MB
Current / Peak Usage   151 MB / 152 MB
Utilization          7 %
     
E.       Physical Address Extension (PAE)          
Supported by Operating System             Yes
Supported by CPU         Yes
Active Yes
Ø  SPD
A.      DIMM1: Kingston (1 GB DDR2-667 DDR2 SDRAM)
A.      Memory Module Properties            
Module Name         Kingston
Serial Number         683B7602h (41302888)
Manufacture Date Week 4 / 2007
Module Size             1 GB (2 ranks, 4 banks)
Module Type           Unbuffered DIMM
Memory Type         DDR2 SDRAM
Memory Speed      DDR2-667 (333 MHz)
Module Width         64 bit
Module Voltage     SSTL 1.8
Refresh Rate            Reduced (7.8 us), Self-Refresh
B.      Memory Timings   
@ 333 MHz               5-5-5-15  (CL-RCD-RP-RAS) / 20-35-3-5-3-3  (RC-RFC-RRD-WR-WTR-RTP)
@ 266 MHz               4-4-4-12  (CL-RCD-RP-RAS) / 16-28-2-4-2-2  (RC-RFC-RRD-WR-WTR-RTP)
@ 200 MHz               3-3-3-9  (CL-RCD-RP-RAS) / 12-21-2-3-2-2  (RC-RFC-RRD-WR-WTR-RTP)
             
C.      Memory Module Features               
Weak Driver             Supported
             
D.      Memory Module Manufacturer     
Company Name     Kingston Technology Corporation
Product Information             http://www.kingston.com/products/default.asp
B.      DIMM3: Kingston (1 GB DDR2-667 DDR2 SDRAM)
A.      Memory Module Properties            
Module Name         Kingston
Serial Number         683B7602h (41302888)
Manufacture Date Week 4 / 2007
Module Size             1 GB (2 ranks, 4 banks)
Module Type           Unbuffered DIMM
Memory Type         DDR2 SDRAM
Memory Speed      DDR2-667 (333 MHz)
Module Width         64 bit
Module Voltage     SSTL 1.8
Refresh Rate            Reduced (7.8 us), Self-Refresh
B.      Memory Timings   
@ 333 MHz               5-5-5-15  (CL-RCD-RP-RAS) / 20-35-3-5-3-3  (RC-RFC-RRD-WR-WTR-RTP)
@ 266 MHz               4-4-4-12  (CL-RCD-RP-RAS) / 16-28-2-4-2-2  (RC-RFC-RRD-WR-WTR-RTP)
@ 200 MHz               3-3-3-9  (CL-RCD-RP-RAS) / 12-21-2-3-2-2  (RC-RFC-RRD-WR-WTR-RTP)
             
C.      Memory Module Features               
Weak Driver             Supported
             
D.      Memory Module Manufacturer     
Company Name     Kingston Technology Corporation
Product Information             http://www.kingston.com/products/default.asp

Ø  Chipset
A.      North Bridge: Intel Bearlake Q33
A.      North Bridge Properties     
North Bridge            Intel Bearlake Q33
Intel Platform          Weybridge (Fundamental)
Revision / Stepping               02 / A2
Package Type          1226 Pin FC-BGA
Package Size            34 mm x 34 mm
Process Technology              90 nm
Core Voltage            1.25 V
TDP              15 W
In-Order Queue Depth        12
             
B.      Memory Controller              
Type            Dual Channel  (128-bit)
Active Mode            Dual Channel  (128-bit)
             
C.      Memory Timings   
CAS Latency (CL)    5T
RAS To CAS Delay (tRCD)    5T
RAS Precharge (tRP)             5T
RAS Active Time (tRAS)       15T
Row Refresh Cycle Time (tRFC)        36T
Command Rate (CR)             2T
RAS To RAS Delay (tRRD)    3T
Write Recovery Time (tWR)               13T
Read To Read Delay (tRTR)                Same Rank: 4T, Different Rank: 6T
Read To Write Delay (tRTW)              8T
Write To Read Delay (tWTR)              Same Rank: 11T, Different Rank: 5T
Write To Write Delay (tWTW)           Same Rank: 4T, Different Rank: 6T
Read To Precharge Delay (tRTP)      5T
Write To Precharge Delay (tWTP)   13T
Precharge To Precharge Delay (tPTP)            1T
Refresh Period (tREF)          2600T
DRAM Read ODT    3T
DRAM Write ODT   6T
MCH Read ODT       8T
Performance Level                8
Read Delay Phase Adjust    Neutral
DIMM1 Clock Fine Delay     0T
DIMM2 Clock Fine Delay     6T
DIMM3 Clock Fine Delay     13T
DIMM4 Clock Fine Delay     5T
             
D.      Error Correction     
             
E.       Memory Slots         
DRAM Slot #1          1 GB  (DDR2-667 DDR2 SDRAM)
DRAM Slot #2          1 GB  (DDR2-667 DDR2 SDRAM)
             
F.       Integrated Graphics Controller       
Graphics Controller Type    Intel GMA 3100
             
G.     PCI Express Controller        
PCI-E 1.0 x16 port #2             In Use @ x16  (Asus EN6600 Video Adapter)
             
E.       Chipset Manufacturer        
Company Name     Intel Corporation
Product Information             http://www.intel.com/products/chipsets
Driver Download    http://support.intel.com/support/chipsets
BIOS Upgrades        http://www.aida64.com/bios-updates
Driver Update         http://www.aida64.com/driver-updates
B.      South Bridge: Intel 82801IB ICH9
A.      South Bridge Properties     
South Bridge            Intel 82801IB ICH9
Intel Platform          Weybridge (Fundamental)
Revision / Stepping               92 / A2
Package Type          676 Pin mBGA
Package Size            31 mm x 31 mm
Process Technology              130 nm
Core Voltage            1.05 V
TDP              4.3 W
             
B.      High Definition Audio          
Codec Name            Analog Devices AD1884
Codec ID    11D41884h / 103C281Eh
Codec Revision       1001h
Codec Type              Audio
             
C.      PCI Express Controller        
     
D.      Chipset Manufacturer        
Company Name     Intel Corporation
Product Information             http://www.intel.com/products/chipsets
Driver Download    http://support.intel.com/support/chipsets
BIOS Upgrades        http://www.aida64.com/bios-updates
Driver Update         http://www.aida64.com/driver-updates
Ø  BIOS
A.      BIOS Properties             
BIOS Type Compaq
BIOS Version            786F2 v01.51
Compaq BIOS Ownership Tag           Unknown
Compaq BIOS UUID              Unknown
System BIOS Date  08/01/08
Video BIOS Date     02/23/05
             
B.      BIOS Manufacturer      
Company Name     Hewlett-Packard Company
Product Information             http://www.compaq.com
BIOS Upgrades        http://www.aida64.com/bios-updates
             
C.      Problems & Suggestions            
Suggestion                System BIOS is more than 2 years old. Update it if necessary.
Suggestion                Video BIOS is more than 2 years old. Update it if necessary.
Ø  ACPI
1.       Table Description
2.       APIC: Multiple APIC Description Table
3.       ASF!: Alert Standard Format Table
4.       DSDT: Differentiated System Description Table
5.       FACP: Fixed ACPI Description Table
6.       FACS: Firmware ACPI Control Structure
7.       HPET: IA-PC High Precision Event Timer Table
8.       MCFG: Memory Mapped Configuration Space Base Address Description Table
9.       RSD PTR: Root System Description Pointer
10.   RSDT: Root System Description Table
11.   SLIC: Software Licensing Description Table
12.   TCPA: Trusted Computing Platform Alliance Capabilities Table
2.       Operating System
Ø  Operating System
A.      Operating System Properties  
OS Name             Microsoft Windows 7 Ultimate
OS Code Name Vienna
OS Language      English (United States)
OS Installer Language     English (United States)
OS Kernel Type Multiprocessor Free (32-bit)
OS Version          6.1.7600 (Win7 RTM)
OS Installation Date        1/20/2015
OS Root                C:\Windows
     
B.      License Information     
Registered Owner           Pache
Registered Organization              
Product ID           00426-OEM-8992662-00010
Product Key       MHFPT-8C8M2-V9488-FGM44-2C9T3
Product Activation (WPA)            Not Required
     
C.      Current Session             
Computer Name              PACHE-PC
User Name         Pache
Logon Domain   Pache-PC
UpTime                6692 sec (0 days, 1 hours, 51 min, 32 sec)
     
D.      Components Version  
Common Controls           6.16
Windows Mail   6.1.7600.16385 (win7_rtm.090713-1255)
Windows Media Player 12.0.7600.16385 (win7_rtm.090713-1255)
.NET Framework              3.5.30729.4926 built by: NetFXw7
DirectX                                 DirectX 11.0
OpenGL               6.1.7600.16385 (win7_rtm.090713-1255)
               
E.       Operating System Features      
Network Present             Yes
Terminal Services             Yes

0 komentar:

Langganan: Posting Komentar (Atom)